Sivers Semiconductors of Sweden has signed contracts for the Electronic Warfare and 5G/6G chip development awards with the Northeast Microelectronics Coalition (NEMC) Hub through the U.S. Chips and Science Act.
Funding is provided under the Microelectronics Commons program, executed through the Naval Surface Warfare Center Crane Division and the National Security Technology Accelerator (NSTXL).
The awards validate Sivers’ wireless technology as a critical enabler for mmWave technology adoption.
Sivers will work with BAE Systems, Raytheon, and Ericsson in commercialising RF and beamforming technology for defense and dual-use applications.
Advance payment of roughly half of the first-year value of both programs is expected to occur by January 2025. If renewed over three years, under the discretion of future awards under the Microelectronics Commons program, the overall funding of both programs is expected to amount to approximately $30 million.
“We are honored and grateful for these first two US CHIPS and Science Act funding awards and appreciate the support from the NEMC hub in helping find the right balance on associated contract structure and milestones,” said Vickram Vathulya, CEO of Sivers Semiconductors. “As we move forward with these critical portfolio projects, we remain committed to optimizing cash flow across all our development contracts, ensuring efficient working capital management while scaling our engagements.
“FR3 represents the next leap in cellular innovation, merging the superior range of sub-6GHz with the high-speed capabilities of millimeter-waves,” says Sivers md Harish Krishnaswamy.
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