Positioned under its flagship Dimensity 9400 and premium 8400, the new 7400 and 7400X are optimised for gaming and AI camera processing.
Built on TSMC’s 4nm process, both 7400 chips have an octa-core CPU: 4x 2.6GHz Arm Cortex-A78 cores and 4x 2GHz Cortex-A55 cores, boosted by an Arm Mali-G615 MC2 GPU.
They also have the sixth generation of the company’s NPU (neural processor), and MAGT 3.0 (MediaTek advanced gaming technology) that reduces input lag by adjusting game settings based on device workload.
AI multimedia and camera capabilities are supported by an Imagiq 950 image signal processor and Google Ultra HDR for higher image dynamic range.
7400X also supports dual-dislay flip-phones.
Radio-wise, they get a 5G R16 modem with 3CC carrier aggregation, and tri-band Wi-Fi 6E support multi-gigabit wireless.
At the same time, the company announced Dimensity 6400, a 6nm lower-performance octa-core (2x 2.5GHz Cortex-A76, 6x 2GHz Cortex-A55) phone processor with an Arm Mali-G57 MC2 GPU.
This chipset gets a Release 16 Sub-6 5G modem that supports 2CC carrier aggregation.
Its image processing can handle billion-colour displays with 10-bit images and 108Mpixel cameras.
The first phones including 7400 and 7400X are expected this quarter.
