It is the JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard. The association says JESD328 is designed to provide a memory platform to deliver modular, low-power, high-bandwidth memory for AI CPU servers.
Specifically, the new standard will define a compact LPDDR5X-based module, Small Outline CAMM2 (SOCAMM2).
The Solid State Technology Association writes:
“JESD328 SOCAMM2 is set to introduce an optimized, compact form factor for servers with a mechanical outline designed for high-density data center chassis and board layouts, with scalability to provide a path to support the large module capacities required by AI training and inference servers.”
“To support the high-performance demands of these data center applications, the standard is forecast to support the full LPDDR5X data rate, including configurations up to 9.6 Gb/s per pin where platform signal integrity allows. The use of low power LPDDR5/5X memory devices reduces system energy and cooling requirements, a key feature in efficient large data processing.”
It also highlights that SOCAMM2 will introduce a Serial Presence Detect (SPD) configuration device. This will support the module-level identification required in enterprise deployments.
Image: Micron LPDDR5X memory
See also: JEDEC updates DDR5 SPD standard
