The devices support higher DC-link voltages and enable improved thermal performance, reduced system size and enhanced reliability.
The package technology supports reflow soldering at 260°C for up to three cycles and enables reliable operation with junction temperatures up to 200°C, while ensuring high peak current capability.
Leveraging the Infineon .XT interconnection technology, the devices deliver improved thermal performance and enhanced mechanical robustness for demanding environments.
The 1400 V voltage class provides additional margin for faster switching and simplifies protection measures against overvoltage. This eliminates the need for power derating and contributes to overall system robustness.
The device is available in RDS(on) classes from 6 to 29 mΩ and suitable for applications where high power density is crucial, such as CAVs, electric vehicle charging and battery energy storage systems.
Infineon also offers CoolSiC MOSFETs 1400 V in a TO-247-4 package with high creepage. RDS(on) classes for this portfolio range from 11 to 38 mΩ, with devices suitable also for applications such as photovoltaic.
More at: www.infineon.com/part/IMYR140R006M2H.
