The agreement extends to Bosch‘s MEMS sensors, asics and SiC chips. “We are convinced that automotive manufacturers and suppliers in Europe will benefit from our co-operation,” said Philipp Schäfer, sales manager at Bosch Mobility Electronics.
Two generations of Bosch SiC chips are available, the latest of which has “very low on-resistance over the entire temperature range”. They are available as bare die and as packaged discrete chips.
The agreement also encompasses asic components and gate drivers available for SiC chips with intelligent control for electric vehicles.
Bosch manufactures more than four million MEMS sensors every day. The company says around one in three of the 20 MEMS sensors installed in a typical vehicle today is from Bosch.. Its portfolio includes acceleration, rotation rate, and pressure sensors to detect motion in adaptive chassis control and ensure that airbags are released appropriately. There is also an integrated Bluetooth low-energy sensor solution for tyre pressure monitoring with “minimal power consumption”. The offering also includes sensors for ‘road noise cancelling’, condition monitoring of machines and equipment, and the latest generation of inertial sensors for navigation applications.
