The sensors are made using 3D stacking and offer both global shutter and rolling shutter modes.
- VD5943 monochrome bare die
- VB5943 monochrome BGA package
- VD1943 RGB-IR bare die
- VB1943 RGB-IR BGA package
“Global and rolling shutter modes allow customers to optimise image capture, ensuring motion-artifact-free video capture [global shutter] and low-noise, high-detail imaging [rolling shutter] at the same time. This architecture is unique on market today,” said ST imaging general manager Alexandre Balmefrezol.
The devices are back-side illuminated, pixels measure 2.25µm, and capacitive deep trench isolation is used.
It is a 7.29mm (1/2.5in) sensor, available as a 5.76 x 4.46mm die or in a 10.3 x 8.9mm BGA package – claimed array-to-die area ratio is 73%.
There are monochrome and RGB-IR variants, with the latter having on-chip RGB-IR separation, and can be switched between: 5Mpixel RGB-NIR 4×4, 5Mpixel RGB Bayer, 1.27Mpixel near-IR sub-sampling and 5MP near-IR up-scale – with independent exposure times.
Samples are availble now, with production scheduled for February 2026.
Applications are foreseen in robotic vision, biometric identification, traffic management, inventory management and automated check-out.
as an example, ST’s product page for the VD1943 can be found here
Earlier this year, the 3.2Gpixel image sensor of the Vera Rubin Observatory began operations in Chile
