The N2 certification includes the new LSVRF (Local Standard Verification Rule Format) functionality in Calibre, which enables independent rule checking within specific regions of a processor for optimal verification accuracy. The collaboration around Siemens’ Calibre portfolio also includes TSMC N2 qualification for Siemens’ Calibre xACT software.
Siemens and TSMC have collaborated to certify parts of Siemens’ Solido Simulation Suite software for analog, mixed-signal, RF and memory designs, with the recent certification of Siemens’ Solido SPICE and Analog FastSPICE (AFS) tools for TSMC’s N2 and N2P processes.
Further, as part of the custom design reference flow (CDRF) for TSMC’s N2 process, Siemens’ AFS tool now supports TSMC’s Reliability Aware Simulation technology, which addresses IC aging and real-time self-heating effects, among other advanced reliability features. The CDRF for TSMC’s N2 technology also integrates Siemens’ Solido Design Environment software for advanced variation-aware verification.
To support and advance next-generation physical implementation designs, TSMC has qualified Siemens’ Aprisa™ software for place-and-route for the foundry’s N3E and N3P processes to offer Aprisa customers new levels of performance and power efficiency.
Siemens and TSMC are aleo working to develop a flow methodology to help customers leverage the foundry’s CUniversal Photonic Engines (COUPE) silicon photonics technology using Siemens’ tools. The on-going collaborations include Tanner software custom IC tools for photonics IC design, Xpedition Substrate Integrator software for system assembly and Siemens’ Calibre® 3DStack software for the physical verification of the entire COUPE integrated system.
Siemens and TSMC have also collaborated on the definition and testing of Calibre 3DThermal software, which is Siemens’ newest thermal analysis solution for verification and debugging of advanced 3D integrated circuits (3D-ICs)..
