The collaboration will explore critical needs in semiconductor innovation and secure manufacturing across a range of chip technologies, including 3D heterogeneous integration for chip packaging; silicon photonics for low-power and high-speed data transport; GaN-on-Siband chiplets.
The collaboration supports the CHIPS and Science Act’s objectives of increasing traceability, 
provenance, and onshore production of critical semiconductor technologies to strengthen national and economic security and domestic supply chains.
“Lockheed Martin is focused on delivering cutting-edge 21st Century Security capabilities that advance deterrence and keep our customers ahead of emerging threats,” said Lockheed CEO Jim Taiclet, “this begins with securely manufactured semiconductors.”
“We are proud to collaborate with Lockheed Martin to address the growing need for a reliable supply of trusted, feature-rich semiconductors for mission-critical security systems,” said GloFo CEO Tom Caulfield..
GloFo’s manufacturing facilities in New York and Vermont have Trusted accreditation from the U.S. government and are authorised to produce secure chips for use in security sensitive systems on land, air, sea, and in space.
Both companies are committed to helping strengthen the supply chain for semiconductors used in critical defense systems and to pursue external funding opportunities, technology development, and collaboration with the U.S. government.
