Glass-based technologies share many entry points with panel-level packaging, with the same goal of increasing package sizes and integration density.
Regional supply ecosystems in China, Korea, and Japan are rapidly developing to support local demand and reduce dependence on alternatives.
“Glass has quietly moved from a supporting role to a central enabler in advanced packaging,” says Yole’s Bilal Hachemi, “ its mechanical stability, optical transparency, and low coefficient of thermal expansion make it ideal for high-density, high-performance integration, exactly what AI, data center, and 5G applications now demand. The fastest near-term growth is in datacentre and telecom RF packaging, while automotive and defence applications ensure long-term stability and high margins.”
As semiconductor chip architectures become more complex and performance-driven, the materials enabling advanced packaging are evolving just as fast.
Glass materials are now entering a high-growth phase, driven by need and demand from data centers, telecommunications, and AI/HPC applications.
In datacentres, glass guarantees the critical packaging vectors for chiplet fabrics and optical I/O, while in telecommunications, low-loss glass stacks are reshaping 5G/6G RF front ends by reducing size, improving thermal behaviour, and enabling higher frequencies.
Panel-based glass interposers and carriers are becoming essential to large-area packaging and co-packaged optics, as system designers push beyond the limits of traditional silicon and organic substrates.
Glass materials are now positioned at the core of the semiconductor packaging revolution, fuelled by megatrends such as AI, HPC , 5G/6G connectivity, and co-packaged optics.
Glass’ unique properties, including low CTE , superior dimensional stability, and optical transparency, make it indispensable for meeting the mechanical, electrical, and thermal demands of next-generation packaging.
These sectors increasingly rely on chiplet integration, hybrid bonding, and panel-level manufacturing, where glass provides both performance gains and cost advantages.
Yole sees the emergence of new supply chains in Asia, especially in China, Korea, and Japan, as critical factors in scaling production and strengthening the global glass ecosystem for advanced packaging.
